Reflow soldering related equipment
Reflow soldering equipment (Reflow oven)
| RF-110 |
Far infrared rays
1 zone
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Batch-type small reflow soldering equipment (reflow oven). (W)300×(D)550×(H)195mm about 12kg |
| RF-110N2 |
Far infrared rays
1 zone
Nitrogen
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Batch-type small reflow soldering equipment (reflow oven). (W)340×(D)590×(H)210mm about 14kg |
| RF-430 series |
Far infrared rays
4 zones
Nitrogen
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Mesh conveyor type small reflow soldering equipment (reflow oven). (W)1600×(D)660×(H)560mm - (H)600mm about 140 - 180kg |
| RF-460 |
Far infrared rays
6 zones
Nitrogen
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Mesh conveyor type small reflow soldering equipment (reflow oven). (W)1500×(D)590×(H)640mm about 150kg |
| RF-560 |
Far infrared rays
6 zones
Nitrogen
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Mesh conveyor type medium reflow soldering equipment (reflow oven). (W)2200×(D)590×(H)820mm about 280kg |
| RF-630 |
Far infrared rays
6 zones
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Mesh conveyor type small reflow soldering equipment (reflow oven). (W)1500×(D)590×(H)640mm about 140kg |
| RF-630PT |
Far infrared rays
6 zones
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Mesh conveyor type small reflow soldering equipment (reflow oven). (W)1500×(D)590×(H)640mm about 140kg |
| RF-810 |
Far infrared rays
8 zones
Nitrogen
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Mesh conveyor type medium reflow soldering equipment (reflow oven). (W)2730×(D)630×(H)820mm about 380kg |
| RF-210V |
Hot plate type
1 zone
Vacuum
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This equipment solders in a vacuum environment. Void-free soldering holding a void in check in several percent or less is possible. (W)600×(D)800×(H)860mm about 135kg |
| RF-221 |
Hot plate type
2 zones
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Reflow soldering equipment (reflow oven) of metal circuit boards exclusive use. (W)800×(D)370×(H)234mm about 25kg |
| RF-250 |
Hot plate type
5 zones
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Reflow soldering equipment (reflow oven) of metal circuit boards exclusive use. (W)1680×(D)550×(H)391mm about 120kg |
| RF-250N2 |
Hot plate type
5 zones
Nitrogen
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Reflow soldering equipment (reflow oven) of metal circuit boards exclusive use. (W)1680×(D)550×(H)1070mm about 170kg |
| RF-250-8 |
Hot plate type
8 zones
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Reflow soldering equipment (reflow oven) of metal circuit boards exclusive use. (W)2370×(D)550×(H)620mm about 181kg |
| VF-500IS |
VPS
1 zone
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Batch type vapor phase reflow soldering equipment. (W)260×(D)260×(H)520mm about 10kg |
Reflow checker (Temperature profiler)
| CTP series | (CTP-300J, CTP-300U, CTP-600U) |
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Simple reflow checker. Please prepare a PC separately. (W)150×(D)170×(H)54mm 500g |
Hot plate
These are easy-to-use high-precision hot plates developed for pre-heated or reflow soldering of SMT PC boards, and can be used in QFP, BGA repair work etc.
| HT-1350 |
MAX 300 °C
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This model includes a work plate, providing greater efficiency and safety. (W)250×(D)180×(H)117mm about 2.5kg |
| HT-1350C |
MAX 300 °C
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HT-1350C has the cover. Danger that touches the hot plate of the high temperature disappears by covering with the cover after it uses it. (W)260×(D)200×(H)137mm about 3kg |
| HT-1370 |
MAX 350 °C
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This model includes a work plate, providing greater efficiency and safety. (W)250×(D)180×(H)120mm about 2.5kg |
| HT-1370C |
MAX 350 °C
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HT-1370C has the cover. Danger that touches the hot plate of the high temperature disappears by covering with the cover after it uses it. (W)260×(D)200×(H)140mm about 3kg |
| HT-1420 |
MAX 400 °C
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The model HT-1420 is a hot plate which allows partial heating. (MIN 26×26mm) (W)200×(D)220×(H)270mm about 2.8kg |
| HT-1800 |
MAX 400 °C
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Provided with two hot plates allows separate use for preliminary heating and heating. (W)430×(D)180×(H)113mm about 5kg |
Light Beam Soldering Equipment
| LP-8150MK2 | |
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Near-infrared rays emitted by the 150W halogen lamp are collected by the reflecting mirror, which concentrates some 850°C of heat at the focal point (a spot with a diameter of about 5mm). (W)230×(D)200×(H)300mm about 6.5kg |
Dispenser
| HD-6780 | |
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The HD-6780 dispenser is an air-type dispenser unit designed for coating a fixed amount of cream solder on Hybrid IC boards and SMT boards. (Cream solder is sold separately.) (W)200×(D)190×(H)70mm about 1.9kg |
Screen printer
Manual type screen printer
| SP-100 | |
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This is a screen printer which uses a micro screen. The usual metal mask cannot be used. (W)250×(D)450×(H)160mm about 8kg |
| SP-300L | |
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Simple manual type screen printer. (W)250×(D)600×(H)200mm about 7kg |
| SP-450 | |
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Manual type screen printer. Fine tuning of X, Y, and θ can be performed simply. (W)350×(D)660×(H)360mm about 11kg |
| SP-650 | |
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Large-sized manual type screen printer. Large-sized metal mask can be used. (W)400×(D)1030×(H)480mm about 25kg |
Metal mask
| µS-100 series | |
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Micro screen µS-100 series µS-100series is metal mask for printing cream solder onto single LSI such as QFP, and CSP, BGA. 14×28mm - 54×63mm |
Vacuum tweezer
| VP series | |
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Uses a general-purpose electromagnetic diaphragm pump, eliminating the need for vacuum or air sources. (Except for model VP-100SD) (W)67×(D)114×(H)54mm - (W)91×(D)132×(H)60mm 230g - 420g |
Mounter
| MP-7500 series | |
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MP-7500 series are the manual mounters used specifically for QFP or PLCC. (W)640×(D)630×(H)135mm - (W)640×(D)650×(H)500mm 25kg - 35kg |
Reballing system
It is equipment and jig which generate the terminal of ball solder to BGA or CSP.
Ball solder is aligned on the package of BGA or CSP using a metal mask.
| BM-11 series | |
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The holder which fixes a package, and the mask where ball solder is aligned. Even the ball solder of a minimum of 0.4 mmφ corresponds. |
| SP-100BR | |
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Using a micro screen (µS-100 series is sold separately), the ball solder used as a terminal is aligned on a package. Even the ball solder of a minimum of 0.3 mmφ corresponds. Main unit : (W)250×(L)450×(H)160mm about 8kg Control box : (W)170×(D)220×(H)110mm 2kg |
| BM-100 | |
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Using a micro screen (µS-100 series is sold separately), the ball solder used as a terminal is aligned on a package. Alining it performs it in a micrometer. Even the ball solder of a minimum of 0.3 mmφ corresponds. Main unit : (W)240×(D)225×(H)410mm 10kg Control box : (W)180×(D)250×(H)110mm 3kg |
| BM-100V | |
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The model which attached the CCD camera to BM-100. BM-100V alines it while confirming it with a monitor. Even the ball solder of a minimum of 0.3 mmφ corresponds. Main unit : (W)240×(D)325×(H)580mm 12kg Control box : (W)180×(D)250×(H)110mm 3kg |
Epoxy mold equipment
| PC-1000 | |
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PC-1000 is a powder coating device designed for the uniform coating of powder resin on Hybrid IC and other electronic units, to be used for experimental purposes and/or trial runs. (W)350×(D)220×(H)200mm 4.5kg |
