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SMT related equipment

General catalog(PDF) | Selection guide

Spray cream solder

Dispenser
Air-type dispenser unit designed for apply solder paste and adhesive to printed circuit boards.
Screen Printers
Use metal masks to apply solder paste and adhesive to printed circuit boards.
Micro Screen
Metal mask for printing solder paste onto single LSI such as QFP, CSP, and BGA.

Mount a parts

Vacuum Pincettes
Exclusively for SMT parts. They simplify the task of handling electronic patrs such as chip parts and QFP-LSI.
Manual QFP Mounters
The manual pick and place equipments used specifically for 0.3mm fine pitch QFP.

Reflow soldering

Reflow Soldering Equipment
Table top type reflow soldering equipment, there is no need for selecting special installing place, and these are applicable to experimental work, research and mass production as well. All heating zones are equipped with microcomputer PID digital temperature control, so a stable temperature profile is assured.
Hot Plates
Easy-to-use high-precision hot plates developed for pre-heating or reflow soldering of SMT PC boards, and can be used also for QFP and BGA repair work etc.
Light Beam Soldering Equipment
Near-infrared rays emitted by the 150W halogen lamp are collected by the reflecting mirror, which concentrates some 850C of heat at the focal point.
Vapor Phase Reflow Soldering Equipment
For an experimental use or pilot production use batch type vapor phase reflow soldering equipment.
Reflow Checker
Low price reflow checker.

Mount a ball solder

Simple Ball Mounting Device(BM-100)
A machine for mounting ball terminals on BGA, CSP, MCM and other packages by useing a microscreen.
Simple Ball Mounting Device(BM-11series)
Jig for easy mounting of terminal solder balls on BGA, CSP, MCM, etc.

epoxy mold

Powder Coating Equipment
A powder coating equipment designed for the uniform coating of powder resin on Hybrid-IC and other electronic parts.

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