Reflow soldering related equipment
Reflow soldering equipment (Reflow oven)
NEW
Batch-type small reflow soldering equipment (reflow oven).
(W)300×(D)550×(H)195mm about 14kg
NEW
Batch-type small reflow soldering equipment (reflow oven).
(W)340×(D)590×(H)210mm about 16kg
Mesh conveyor type small reflow soldering equipment (reflow oven).
(W)1600×(D)660×(H)560mm - (H)600mm
about 140 - 180kg
Mesh conveyor type small reflow soldering equipment (reflow oven).
(W)1500×(D)590×(H)640mm about 150kg
Mesh conveyor type medium reflow soldering equipment (reflow oven).
(W)2200×(D)590×(H)820mm about 280kg
Mesh conveyor type small reflow soldering equipment (reflow oven).
(W)1500×(D)590×(H)640mm about 140kg
Mesh conveyor type small reflow soldering equipment (reflow oven).
(W)1500×(D)590×(H)640mm about 140kg
Mesh conveyor type medium reflow soldering equipment (reflow oven).
(W)2730×(D)630×(H)820mm about 380kg
This equipment solders in a vacuum environment.
Void-free soldering holding a void in check in several percent or less is possible.
(W)600×(D)800×(H)860mm about 135kg
Reflow soldering equipment (reflow oven) of metal circuit boards exclusive use.
(W)1680×(D)550×(H)391mm about 120kg
Reflow soldering equipment (reflow oven) of metal circuit boards exclusive use.
(W)1680×(D)550×(H)1070mm about 170kg
Reflow soldering equipment (reflow oven) of metal circuit boards exclusive use.
(W)2370×(D)550×(H)620mm about 181kg
Batch type vapor phase reflow soldering equipment.
(W)260×(D)260×(H)520mm about 10kg
Reflow checker (Temperature profiler)
Simple reflow checker.
Please prepare a PC separately.
(W)150×(D)170×(H)54mm 500g
Hot plate
These are easy-to-use high-precision hot plates developed for pre-heated or reflow soldering of SMT PC boards, and can be used in QFP, BGA repair work etc.
This model includes a work plate, providing greater efficiency and safety.
(W)250×(D)180×(H)117mm about 2.5kg
HT-1350C has the cover.
Danger that touches the hot plate of the high temperature disappears by covering with the cover after it uses it.
(W)260×(D)200×(H)137mm about 3kg
This model includes a work plate, providing greater efficiency and safety.
(W)250×(D)180×(H)120mm about 2.5kg
HT-1370C has the cover.
Danger that touches the hot plate of the high temperature disappears by covering with the cover after it uses it.
(W)260×(D)200×(H)140mm about 3kg
The model HT-1420 is a hot plate which allows partial heating. (MIN 26×26mm)
(W)200×(D)220×(H)270mm about 2.8kg
Provided with two hot plates allows separate use for preliminary heating and heating.
(W)430×(D)180×(H)113mm about 5kg
Light Beam Soldering Equipment
Near-infrared rays emitted by the 150W halogen lamp are collected by the reflecting mirror, which concentrates some 850°C of heat at the focal point (a spot with a diameter of about 5mm).
(W)230×(D)200×(H)300mm about 6.5kg
Dispenser
The HD-6780 dispenser is an air-type dispenser unit designed for coating a fixed amount of cream solder on Hybrid IC boards and SMT boards.
(Cream solder is sold separately.)
(W)200×(D)190×(H)70mm about 1.9kg
Screen printer
Manual type screen printer
This is a screen printer which uses a micro screen. The usual metal mask cannot be used.
(W)250×(D)450×(H)160mm about 8kg
Simple manual type screen printer.
(W)250×(D)600×(H)200mm about 7kg
Manual type screen printer.
Fine tuning of X, Y, and θ can be performed simply.
(W)350×(D)660×(H)360mm about 11kg
Large-sized manual type screen printer.
Large-sized metal mask can be used.
(W)400×(D)1030×(H)480mm about 25kg
Metal mask
Micro screen µS-100 series
µS-100series is metal mask for printing cream solder onto single LSI such as QFP, and CSP, BGA.
14×28mm - 54×63mm
Vacuum tweezer
Uses a general-purpose electromagnetic diaphragm pump, eliminating the need for vacuum or air sources. (Except for model VP-100SD)
(W)67×(D)114×(H)54mm - (W)91×(D)132×(H)60mm
230g - 420g
Mounter
MP-7500 series are the manual mounters used specifically for QFP or PLCC.
(W)640×(D)630×(H)135mm - (W)640×(D)650×(H)500mm
25kg - 35kg
BGA remover
BR-515 is an exclusive device removing BGA from PCB. This device removes BGA which applied underfill material easily in 20-80 seconds.
(W)260×(D)370×(H)360mm
About 13kg
Reballing system
It is equipment and jig which generate the terminal of ball solder to BGA or CSP.
Ball solder is aligned on the package of BGA or CSP using a metal mask.
The holder which fixes a package, and the mask where ball solder is aligned.
Even the ball solder of a minimum of 0.4 mmφ corresponds.
Using a micro screen (µS-100 series is sold separately), the ball solder used as a terminal is aligned on a package.
Even the ball solder of a minimum of 0.3 mmφ corresponds.
Main unit : (W)250×(L)450×(H)160mm about 8kg
Control box : (W)170×(D)220×(H)110mm 2kg
Using a micro screen (µS-100 series is sold separately), the ball solder used as a terminal is aligned on a package.
Alining it performs it in a micrometer.
Even the ball solder of a minimum of 0.3 mmφ corresponds.
Main unit : (W)240×(D)225×(H)410mm 10kg
Control box : (W)180×(D)250×(H)110mm 3kg
The model which attached the CCD camera to BM-100.
BM-100V alines it while confirming it with a monitor.
Even the ball solder of a minimum of 0.3 mmφ corresponds.
Main unit : (W)240×(D)325×(H)580mm 12kg
Control box : (W)180×(D)250×(H)110mm 3kg
Epoxy mold equipment
PC-1000 is a powder coating device designed for the uniform coating of powder resin on Hybrid IC and other electronic units, to be used for experimental purposes and/or trial runs.
(W)350×(D)220×(H)200mm 4.5kg
