BM-100
Catalog BGA removing video
Reflow soldering
General Catalog Reflow soldering equipment ▶ RF-110MK2 RF-110N2MK2 RF-430 series RF-460 RF-560 RF-630 RF-630PT RF-810 RF-210V RF-250 RF-250N2 RF-250-8 VF-500IS Reflow checker ▶ CTP series Hot plate ▶ HT-1350 HT-1350C HT-1370 HT-1370C HT-1420 HT-1800 Light beam soldering equipment ▶ LP-8150MK2 Dispenser ▶ HD-6780 Screen printer ▶ SP-100 SP-300L SP-450 SP-650 Metal mask ▶ µS-100 series Vacuum tweezer ▶ VP series Mounter ▶ MP-7500 series BGA remover BR-515 Reballing system ▶ BM-11 series SP-100BR BM-100 BM-100V Epoxy mold equipment ▶ PC-1000

BR-515

BR-515 is an exclusive device removing BGA from PCB of a Smartphone, Aoutmotive navigation system and Tablet PCs. This device removes BGA which applied underfill material easily in 20-80 seconds. And positioning of PCB is very simple, too. Accordingly 1/3-1/10 can shorten work time than the BGA removal by Rework stations. And repair yield improves very much.

Features

BR-515 removes BGA with underfill from PCB in 20-80 seconds.
This device is overheated with a heating tip directly from the BGA upper part.
This device fits strongest epoxy underfill material.
This device removes BGA from PCB before underfill material does curing by a short time heating.
Only BGA heats directly, and this device does not heat an adjacent part. And PCB bottom heater is unnecessary.
Positioning of PCB is very simple.
1. Do Setting PCB to a work holder.
2. Do positioning of BGA to a bottom of a heating tip.
3. Do fixing a work holder with an electromagnet.
BR-515 is equipped with Thermo-profiler of 3ch. This Thermo-profiler measures heating temperature and time of BGA. Then this Thermo-profiler operates independently.

Specifications

Applicable BGA	7mm×7mm - 20mm×20mm
Applicable PCB	Normal work holder : 30×30mm - 170×105mm t : 0.4 - 1.2mm Optional work holder : 50×50mm - 220×160mm t : 0.4 - 1.6mm
Heating temperature	Heating bar : 300 - 440°C (Heating tip : 280 - 420°C) PID Control.
Heating time	Auto : 0.1 - 999.9sec (Timer) Manual : START - RESET (Free)
Heating tip	Aluminum (5052) + Dioxide Molybdenum coating (Hard lubrication coating) Normal accessories (3pcs) : 7mm×7mm, 12mm×12mm, 18mm×18mm Optional tip : 8mm×8mm, 10mm×10mm, 15mm×15mm, 20mm×20mm, Special order tip.
Tip contact pressure	About300g, Pressure adjustment : +5 steps /-2 steps, 0.5mm step. Height of a heating tip : +2.5mm (5 steps) / -1.0mm (2 steps)
Positioning	Take down a heating tip to an around on BGA. And match a position with BGA.
Work holder	Normal work holder : (W)200mm×(D)125mm×(H)21mm 600g Optional work holder : (W)240mm×(D)180mm×(H)21mm 1050g PCB lower part support : Silicon sponge, attachment t=8mm/10mm (consumption articles) Positioning : Free (X - Y) Fixation : Electromagnetic lock
Thermo-profiler	3ch, Software attachment. (PC is not attached.) Equivalent of Reflow checker CTP-300U
Power supply	Single-phase, AC100V 270W / AC220V 270W
External dimensions	(W)260×(D)370×(H)360mm
Weight	About 13kg