Japan Pulse Laboratories, Inc.

Reflow soldering related machine

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• Using the special holder and screen arranged separately for each of the BGA, CSP, MCM, etc. packages, anyone can easily mount solder balls. Operation is easy while the price is less the one tenth of the previous models.
• Cavity-Down which were difficult until now can be easily carried out.
• No need for complicated flux/cream solder printing and screen adjustment.
  1. Spray the aerosol-type flux on the whole terminal of a package.
  2. Set the package in the holder, then set on the top of that the screen for ball mounting for simple positioning.
  3. Put on the screen a few more solder balls than the number of the terminals, then shake the holder several times to drop the balls into the holes.
  4. Press down the rear end of the screen, then lift a bit the front edge. Lift up the screen along with the remaining balls. The ball mounting procedure is thus finished.
  5. Insert the whole package in the holder into the reflow equipment and carry out soldering. The re-balling process is complete.