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TOP > Reflow soldering related equipment > BM-11 series

BM-11 series

The BM-11 is a jig for easy mounting of terminal solder balls on BGA, CSP, MCM, etc. Even beginners can easily carry out re-balling. Cavity-Down which were difficult until now can be easily carried out. Moreover, the price constitutes less than one tenth of the previous models.

• Using the special holder and screen arranged separately for each of the BGA, CSP, MCM, etc. packages, anyone can easily mount solder balls. Operation is easy while the price is less the one tenth of the previous models.
• Cavity-Down which were difficult until now can be easily carried out.
• No need for complicated flux/cream solder printing and screen adjustment.

Ball mounting screen	Material	SUS304
	Dimensions	40×40mm, 50×50mm, 60×60mm, 70×70mm
Package holder	Material	Aluminum
	Dimensions	50×50mm, 60×60mm, 70×70mm, 80×80mm
	Thickness	2mm, 3mm
	Weight	2 to 10g