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TOP > Reflow soldering related equipment > BM-100

BM-100

The BM-100 is machine for mounting ball terminals on BGA, CSP, MCM and other packages by useing a microscreen (µS-100series, option). lts applicability ranges from CSP with 30 pins to MCM with 3,000 pins for balls with a diameter of 0.28mmφ to 0.89mmφ. With the machine it is easy to mount ball terminals on a small quantity of packages when reballing on reprocessed packages, or when mounting balls on newly developed chips, etc.

• Application range from CSP with 30 pins to BGA and MCM with 3,000 pins for balls with a diameter of 0.28mmφ to 0.89mmφ. (Depending on a microscreen selected for use with a package. The microscreen is optional.)
• Flux/cream solder printing and ball mounting are possible with this single machine. (Both the screen for cream printing and the screen for ball aligning these devices are necessary.)
• The screen position (X, Y, Z) can be fine-adjusted with 10µm accuracy based on the micro meter.
• Fixation of the package and the screen vertical movement are controlled automatically with the opereting switch.
• It is possible to carry out reflow-soldering immediately after ball alignment; a manual-type N₂ reflow machine RF-110N2 is also available.

Fine-adjustment of X,Y,Z		15mm (10µm steps)
Air input		2 to 5kgf/cm2
Hose		OD6mmφ×ID4mm&phi/
Power supply		AC120V or 220V 100VA 50/60Hz
External dimensions, Weight	Main unit	(W)240×(D)225×(H)410mm 10kg
	Control box	(W)180×(D)250×(H)110mm 3kg

µS-100 series (option)
Size		14×28mm to 54×63mm (7 kinds)
Thickness		0.15mm or 0.13mm
Material	Frame	SPCC
	Screen	SUS304