RF-210V
Great for Power semiconductors, Power modules which have current devices that require keeping void to few percent below and this machine is able to perform void free soldering.
Features
- Reflow soldering in under -95kPa(G) super-high vacuum environment
- Compatible to Maximum 400°C 150mm × 150mm Work
- This is 2 Zone by 1 Hot plate heating zone, 1 Cooling zone type vacuum soldering unit
- Able to use Nitrogen(N2) and Green Gas(Soldering in Gas Atmosphere)
- Able to see while soldering in vacuum environment from observation window
Specifications
| Heating Zone | Zone | 1 |
|---|---|---|
| Size | 150mm×150mm | |
| Method | Direct heating from Hotplate underneath of Work | |
| Temperature | Max400°C | |
| Cooling Zone | Zone | 1 |
| Size | 150mm×150mm | |
| Method | Direct cooling from Cooling Plate underneath of Work | |
| Conveyor | Carrier Bar(Push Work by Metal) system or 0.125mmt Teflon Sheet (or 30µmt SUS304 Sheet) carrier system | |
| Vacuum Source | Vacuum Pump : Max -98kPa(G) | |
| Vacuum | -95kPa(G) Time required; 150 sec. (Vacuum from atmosphere) | |
| Chamber | Size | (L)395×(W)340×(H)105mm |
| Work Area | (L)300×(W)150×(H)55mm | |
| Observation Window | 105φ(Reflow part) | |
| Compatible Gas | Gas Atmosphere Soldering : N2 or N2+H2(3-4%) | |
| Control | Touch Panel type Sequencer | |
| Sensor Terminal | Sensors for Temperature profile measurement terminal. 3CH | |
| Safety | Breaker for Leakage/Over current, Emergency Stop Switch | |
| Power source | Single phase 200V/220V/240V 1.5kW 50/60Hz | |
| External dimensions | (W)600×(D)800×(H)860mm | |
| Weight | about 135kg | |
