BM-100V
Features
- Application range from CSP with 30 pins to BGA and MCM with 3,000 pins for balls with a diameter of 0.28mmφ to 0.89mmφ. (Depending on a microscreen selected for use with a package. The microscreen is optional.)
- Flux/cream solder printing and ball mounting are possible with this single machine. (Both the screen for cream printing and the screen for ball aligning these devices are necessary.)
- The screen position (X, Y, Z) can be fine-adjusted with 10µm accuracy based on the micro meter.
- Fixation of the package and the screen vertical movement are controlled automatically with the opereting switch.
- It is possible to carry out reflow-soldering immediately after ball alignment; a manual-type N2 reflow machine RF-110N2 is also available.
- The high resolution CCD camera with a zoom lens allows an easy positioning of the screen and the work. With the 5.8× to 17.8× zoom it is easy to handle positioning of packages even with large and microscopic patterns.
Specifications
Fine-adjustment of X,Y,Z | 15mm (10µm steps) | |
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Air input | 2 to 5kgf/cm2 | |
Hose | OD6mmφ×ID4mm&phi/ | |
Power supply | AC120V or 220V 100VA 50/60Hz | |
External dimensions, Weight | Main unit | (W)240×(D)325×(H)580mm 12kg |
Control box | (W)180×(D)250×(H)110mm 3kg | |
CCD camera | CCD | 350,000 pixels, 1/2 inch |
Display magnification | 5.8× to 17.8× zoom | |
Monitor | 13inch LCD monitor |
µS-100 series (option) | ||
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Size | 14×28mm to 54×63mm (7 kinds) | |
Thickness | 0.15mm or 0.13mm | |
Material | Frame | SPCC |
Screen | SUS304 |