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BM-100V
Reflow soldering

BM-100V

The BM-100V is machine for mounting ball terminals on BGA, CSP, MCM and other packages by useing a microscreen (µS-100series, option). lts applicability ranges from CSP with 30 pins to MCM with 3,000 pins for balls with a diameter of 0.28mmφ to 0.89mmφ. With the machine it is easy to mount ball terminals on a small quantity of packages when reballing on reprocessed packages, or when mounting balls on newly developed chips, etc.
Features
Specifications
Fine-adjustment of X,Y,Z15mm (10µm steps)
Air input2 to 5kgf/cm2
HoseOD6mmφ×ID4mm&phi/
Power supplyAC120V or 220V 100VA 50/60Hz
External dimensions,
Weight
Main unit(W)240×(D)325×(H)580mm 12kg
Control box(W)180×(D)250×(H)110mm 3kg
CCD cameraCCD350,000 pixels, 1/2 inch
Display magnification5.8× to 17.8× zoom
Monitor13inch LCD monitor

µS-100 series (option)
Size14×28mm to 54×63mm (7 kinds)
Thickness0.15mm or 0.13mm
MaterialFrameSPCC
ScreenSUS304