Japan Pulse Laboratories, Inc.
General catalog
catalogSP-100BR
The SP-100BR is machine for mounting ball terminals on BGA, CSP, MCM and other packages by useing a microscreen (µS-100series, option). lts applicability ranges from CSP with 30 pins to MCM with 3,000 pins for balls with a diameter of 0.28mmø to 0.89mmø. With the machine it is easy to mount ball terminals on a small quantity of packages when re-balling on reprocessed packages, or when mounting balls on newly developed chips, etc.Features
- Application range from CSP with 30 pins to BGA and MCM with 3,000 pins for balls with a diameter of 0.28mmø to 0.89mmø. (Depending on a microscreen selected for use with a package. The microscreen is optional.)
- Flux/cream solder printing and ball mounting are possible with this single machine. (Both the screen for cream printing and the screen for ball aligning these devices are necessary.)
- The screen position (X, Y, Z) can be fine-adjusted with 10µm accuracy based on the micro meter.
- It is possible to carry out reflow-soldering immediately after ball alignment; a manual-type N2 reflow machine RF-110N2 is also available.
Specifications
| Fine-adjustment of X,Y,Z | 15mm (10µm steps) | |
|---|---|---|
| Power supply | AC120V or 220V 10VA 50/60Hz | |
| External dimensions, Weight | Main unit | (W)250×(D)450×(H)160mm 8kg |
| Control box | (W)170×(D)220×(H)110mm 2kg | |
| µS-100series (option) | ||
|---|---|---|
| Size | 14×28mm to 54×63mm (7 kinds) | |
| Thickness | 0.15mm or 0.13mm | |
| Material | Frame | SPCC |
| Screen | SUS304 | |
