µS-100 series
Catalog Standard list
Reflow soldering
General Catalog Reflow soldering equipment ▶ RF-110 RF-110N2 RF-430 series RF-460 RF-560 RF-630 RF-630PT RF-810 RF-210V RF-221 RF-250 RF-250N2 RF-250-8 VF-500IS Reflow checker ▶ CTP series Hot plate ▶ HT-1350 HT-1350C HT-1370 HT-1370C HT-1420 HT-1800 Light beam soldering equipment ▶ LP-8150MK2 Dispenser ▶ HD-6780 Screen printer ▶ SP-100 SP-300L SP-450 SP-650 Metal mask µS-100 series Vacuum tweezer ▶ VP series Mounter ▶ MP-7500 series Reballing system ▶ BM-11 series SP-100BR BM-100 BM-100V Epoxy mold equipment ▶ PC-1000

µS-100 series

Micro screen µS-100series is metal mask for printing solder paste (solder cream) onto single LSI such as QFP, and CSP, BGA. You can use this micro screen for printing as many as 50 different patterns, without printing machine. Solder paste application can easily, and securely be done in printing small lots of PC boards and reworking jobs. You can apply solder paste to QFP of 256pins/0.4mm pitch and BGA of 900pins easily and securely, using this low-cost standard micro screen.

Features

Solder paste can be applied only micro screen without printing machine.
About 50 kinds of patterns are carried as standard products, and also screen for BGA/CSP reballing is available.
The use in combination with screen printer Model SP-100, many PC boards can easily and repeatedly be printed.
In case that you require custom-made frame or screen, we can manufacture for you in a matter of 10 days.
Solder paste for micro screen and squeegee and ultrasonic cleanser are available.

Specifications

Stencil	Size	14×28mm to 54×63mm (7 kinds)
	Thickness	0.15mm or 0.13mm
	Material	SUS304
Frame	Material	SPCC
Options		Squeegee (SQ-10, SQ-25, SQ-35, SQ-45)