SP-100
Catalog
Reflow soldering
General Catalog Reflow soldering equipment ▶ RF-110 RF-110N2 RF-430 series RF-460 RF-560 RF-630 RF-630PT RF-810 RF-210V RF-221 RF-250 RF-250N2 RF-250-8 VF-500IS Reflow checker ▶ CTP series Hot plate ▶ HT-1350 HT-1350C HT-1370 HT-1370C HT-1420 HT-1800 Light beam soldering equipment ▶ LP-8150MK2 Dispenser ▶ HD-6780 Screen printer SP-100 SP-300L SP-450 SP-650 Metal mask ▶ µS-100 series Vacuum tweezer ▶ VP series Mounter ▶ MP-7500 series Reballing system ▶ BM-11 series SP-100BR BM-100 BM-100V Epoxy mold equipment ▶ PC-1000

SP-100

Model SP-100 is printer to be used in combination with Micro Screen (µS-100series, option) for applying solder paste (solder cream) to single LSI such as QFP and BGA. You can apply solder paste to PC board by PC board repeatedly with ease and with high precision. (Please see the data on Micro Screen µS-100series together with this.)

Features

Easy positioning of screen(mask) and work piece. As micrometers are fitted onto X-Y axis as standard machine parts, fine adjustment of accuracy 10µm is possible.
By dint of high precision, solder paste can precisely be applied to QFP IC's with fine pitch such as 0.4mm pitch and 0.5mm pitch even in repeated printing.
Micro Screens are available and replaceable just by loosening 2 screw.
Use of PC board holder type PH-100 makes it easier to apply solder paste in rework of dual SMT-PC board. PH-100 is available as an optional item.
Also with the screen for BGA/CSP reballing, BGA and CSP can easily be reballed.

Specifications

X-Y fine adjustment		15mm (resolution 10µm)
Applicable circuit boards	Size	10×10mm to 250×300mm
Applicable circuit boards	Thickness	0.125 to 40mm
External dimensions		(W)250×(L)450×(H)160mm
Weight		about 8kg
Accessories		squeegee (SUS304) 4pcs (SQ-10, SQ-25, SQ-35, SQ-45)

µS-100series (option)
Size		14×28mm to 54×63mm (7 kinds)
Thickness		0.15mm or 0.13mm
Material	Frame	SPCC
Material	Screen	SUS304