Reballing procedure with BM-11 series
Spray flux onto the package.
Place the package in the package holder.
Place the ball-mounting screen on top of the package holder and place a slightly excessive number of balls on top of the screen.
Shake the package holder and screen together so the balls drop into the holes in the screen.
Move the surplus balls to the rear and then use the ball presser to lightly press the balls in the holes.
Using the back of the screen as a fulcrum, use a lever to remove the screen.
For each chip holder, use the reflow device to melt the solder balls and fasten to the package.
